Advanced No-Clean BGA PCB Repair Flux Kit: Residue-Free Soldering Aid for PCB Rework - 10cc

Efficient Cleaning:

• Say goodbye to residue with this no-clean flux kit
• Leaves behind minimal residue
• Eliminates the need for washing

Clean Finish:

• Colorless and transparent residue
• Ensures a pristine and professional end result

Enhanced Performance:

• Excellent printing performance for manual and machine applications
• Rework tasks made easy

Optimal for BGA and CSP Rework:

• Designed for Ball Grid Array (BGA) and Chip-Scale Package (CSP) rework
• Improves soldering success rates

Versatile Application:

• Suitable for BGA ball, semiconductor packaging, and repairs
• Focus on computer motherboard components, communication devices, and graphic applications